I-ETC 2026
MAY 8-9, 2026
In-Person at Brigham Young University
We are excited to announce your keynote speakers for the i-ETC conference this year.
Cement Manufacturing: Interconnected Engineering, Energy, and Environmental Opportunities
This presentation examines how cement is produced, its environmental impact, and the engineering innovations helping reduce emissions and improve sustainability.
Heath Hall is Director of Technical Services for the Western Region at Ash Grove Cement Company, with over 15 years of experience in the cement industry and 7 years in ready-mixed concrete. His work focuses on materials and quality control, and he is an active member of ASTM Committees C01 (Cement, Lime, and Gypsum) and C09 (Concrete and Aggregates). He holds BS and MS degrees in biological engineering from Utah State University and lives in Nephi, Utah with his wife and four children.
Bridge Whispering: Giving Voice to the Secrets of Bridge Decks
This interdisciplinary research uses mechanical excitation and acoustic signal processing to detect internal delamination defects in concrete bridge decks. The result is an automated inspection system capable of operating at highway speeds.
Dr. Brian Mazzeo, originally from Ft. Lauderdale, Florida, earned his BS in electrical engineering from MIT and completed his PhD at Cambridge University as a Marshall Scholar. He joined Brigham Young University in 2008, where he is now a professor of Electrical and Computer Engineering, and his research focuses on electromagnetic and acoustic nondestructive testing, spanning work from protein spectroscopy to developing rapid scanning systems for detecting damage in concrete bridge decks.
I-ETC Conference Paper Awards
Three Premium Paper Awards
Certificate and $300
Three Gold Paper Awards
Certificate and $200
Three Silver Paper Awards
Certificate and $100
I-ETC Conference Poster Awards
Premium Poster Award
Certificate and $300
Gold Poster Award
Certificate and $200
Silver Poster Award
Certificate and $100
I-ETC is an annual event organized in unison with Brigham Young University (BYU), Utah Valley University (UVU), Utah State University (USU), Idaho State University (ISU), Montana State University (MSU), Weber State University (WSU), and several Utah’s technology industries located along Silicon Slopes. The Institute of Electrical and Electronics Engineers (IEEE) is the technical sponsor of i-ETC conferences. All papers presented at the conference will be published in the conference proceedings. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. The conference will offer several prize paper and poster awards to eligible students. I-ETC will be held in person, and papers that are accepted and registered but not presented at the conference will not be published in IEEE Xplore.
📅 I-ETC 2027: In-Person at USU
📅 I-ETC 2028: In-Person at MSU
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