Announcing I-ETC 2026
Dates TBA
Brigham Young University
Students and professors are encouraged to prepare their research papers and posters for submission to the 2026 i-ETC conference, held in collaboration with Utah Valley University, Brigham Young University, Utah State University, and other leading institutions. Submissions will open in the Fall of 2025. Don’t miss this opportunity to showcase your work at a premier technology event along Utah’s Silicon Slopes!
I-ETC Conference Paper Awards
Three Premium Paper Awards
Certificate and $300
Three Gold Paper Awards
Certificate and $200
Three Silver Paper Awards
Certificate and $100
I-ETC Conference Poster Awards
Premium Poster Award
Certificate and $300
Gold Poster Award
Certificate and $200
Silver Poster Award
Certificate and $100
I-ETC is annual event organized in unison with Utah Valley University (UVU), Brigham Young University (BYU), Utah State University (USU), Idaho State University (ISU), Montana State University (MSU), Weber State University (WSU), and several Utah’s technology industries located along Silicon Slopes. The Institute of Electrical and Electronics Engineers (IEEE) is the technical sponsor of i-ETC conferences. All papers presented at the conference will be published in the conference proceedings. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. The conference will offer several prize paper and poster awards to eligible students.
Interested in becoming a sponsor for i-etc? Fill out the form below or download the Sponsorship Information document.
