Submissions for 2025

Students and professors are encouraged to prepare their research papers and posters for submission to the 2025 i-ETC conference, held in collaboration with Utah Valley University, Brigham Young University, Utah State University, and other leading institutions. All submissions must be completed by **February 24, 2025**, to be considered for inclusion in the IEEE Xplore digital library, subject to IEEE's scope and quality standards. Eligible participants will also have the chance to compete for prestigious paper and poster awards. Don’t miss this opportunity to showcase your work at a premier technology event along Utah’s Silicon Slopes!

Call for Papers 2025 PDF

More Submission Information

About i-ETC

I-ETC is annual event organized in unison with Utah Valley University (UVU), Brigham Young University (BYU), Utah State University (USU), Idaho State University (ISU), Montana State University (MSU), Weber State University (WSU), and several Utah’s technology industries located along Silicon Slopes. The Institute of Electrical and Electronics Engineers (IEEE) is the technical sponsor of i-ETC conferences. All papers presented at the conference will be published in the conference proceedings.  Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. The conference will offer several prize paper and poster awards to eligible students.