The Fifth Intermountain Engineering, Technology and Computing Conference (i-ETC 2025) will be held in the picturesque campus of Utah Valley University, Orem, Utah, USA on May 9-10, 2025. 

I-ETC is annual event organized in unison with Utah Valley University (UVU), Brigham Young University (BYU), Utah State University (USU), Idaho State University (ISU), Montana State University (MSU), Weber State University (WSU), and several Utah’s technology industries located along Silicon Slopes. The Institute of Electrical and Electronics Engineers (IEEE) is the technical sponsor of i-ETC conferences. All papers presented at the conference will be published in the conference proceedings and posted in the IEEE digital library (Xplore). The conference will offer several prize paper and poster awards to eligible students.

 

CAll for Papers 2025

Save the Date for i-ETC 2025 - May 9th & 10th 2025
Hosted at Utah Valley University

i-ETC Conference Student Awards

i-ETC will offer a number of student awards for papers/posters that are accepted and presented at the i-ETC 2025 conference. The first author must be a student.

 

Premium Engineering Paper Award
(Certificate and $300)

Gold Engineering Paper Award
(Certificate and $200)

Silver Engineering Paper Award
(Certificate and $100)

 

Premium Technology Paper Award
(Certificate and $300)

Gold Technology Paper Award
(Certificate and $200)

Silver Technology Paper Award
(Certificate and $100)

 

Premium Computing Paper Award
(Certificate and $300)

Gold Computing Paper Award
(Certificate and $200)

Silver Computing Paper Award
(Certificate and $100)

Sponsors

UVU Logo

 

USU Logo

 

MSU Logo

BYU Logo

Idaho State University

 

Weber State Logo

 


IEEE Utah section logo

 

 

 

 

 

Industry Sponsors

 

Rocky Mountain Power

Ready Mix Concrete

 

 

 

Contribution and Sponsorship

If you are interested in contributing to the conference topics or would like to sponsor aspects of the conference please fill out this contact form.

I-ETC 2025 SPONSORSHIP FORM